(12) United States Patent ao) Patent No.: us 6,433,413 Bi
Farrar (45) Date of Patent: Aug. 13,2002
(54) THREE-DIMENSIONAL MULTICHIP MODULE
(75) Inventor: Paul A. Farrar, South Burlington, VT (US)
(73) Assignee: Micron Technology, Inc., Boise, ID (US)
( * ) Notice: Subject to any disclaimer, the term of this patent is extended or adjusted under 35 U.S.C. 154(b) by 0 days.
(21) Appl. No.: 09/932,859
(22) Filed: Aug. 17, 2001
(51) Int. CI.7 H01L 23/48
(52) U.S. CI 257/678; 438/106; 257/777;
(58) Field of Search 257/777, 778,
257/784, 685, 686, 678; 361/689
(56) References Cited
U.S. PATENT DOCUMENTS
4,525,921 A 7/1985 Carson et al.
4,617,160 A 10/1986 Belanger et al.
4,706,166 A 11/1987 Go
5,158,986 A 10/1992 Cha et al.
5,202,754 A 4/1993 Bertin et al.
A three-dimensional multichip module having a base structure formed by a plurality of chips secured together in a stack and a plurality of exterior chips mounted to the exterior faces of the base structure. The multichip module may incorporate memory chips, processor chips, logic chips, A to D converter chips, and other chips in a compact package. The module permits chips that require extensive cooling to be positioned within the structure in a manner such that a large surface area of the chip is not in contact with other chips. The module also permits extensive interconnection between chips within the module.
34 Claims, 5 Drawing Sheets