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US007264996B2
(12) United States Patent ao) Patent No.: Us 7,264,996 B2
Moriceau et al. (45) Date of Patent: Sep. 4,2007
(54) METHOD FOR SEPARATING WAFERS BONDED TOGETHER TO FORM A STACKED STRUCTURE
(75) Inventors: Hubert Moriceau, Saint Egreve (FR);
Frank Fournel, Moirans (FR);
Bernard Aspar, Rives (FR)
(73) Assignee: Commissariat a l'Energie Atomique,
Paris (FR)
( * ) Notice: Subject to any disclaimer, the term of this patent is extended or adjusted under 35 U.S.C. 154(b) by 0 days.
(21) Appl. No.: 10/947,134
(22) Filed: Sep. 23, 2004
(65) Prior Publication Data
US 2005/0112847 Al May 26, 2005
(30) Foreign Application Priority Data
Sep. 30, 2003 (FR) 03 50619
(51) Int. CI.
H01L 21/44 (2006.01)
H01L 21/30 (2006.01)
(52) U.S. CI 438/110; 438/455; 438/458
(58) Field of Classification Search 438/107,
438/110, 455, 457 See application file for complete search history.
