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US 20050211464A1
(19) United States
(12) Patent Application Publication (k» Pub. No.: us 2005/0211464 Al
Byun et al. (43) Pub. Date: Sep. 29, 2005
(54) METHOD OF MICROELECTRODE (30) Foreign Application Priority Data
CONNECTION AND CONNECTED
STRUCTURE OF USE THREOF Jan. 8, 2003 (KR) 1020030001019
(76) Inventors: Jeong II Byun, Gyeonggi-do (KR);
Kyung Joon Lee, Gyeonggi-do (KR);
Myung Kyu Lee, Gyeonggi-do (KR);
Chucksin Peter, Gyeonggi-do (KR)
Correspondence Address:
ALLEN, DYER, DOPPELT, MILBRATH &
GILCHRIST P.A.
1401 CITRUS CENTER 255 SOUTH ORANGE
AVENUE
P.O. BOX 3791
ORLANDO, FL 32802-3791 (US)
(21) Appl. No.: 10/522,049
(22) PCT Filed: Jul. 31, 2003
(86) PCT No.: PCT/KR03/01550
Publication Classification
(51) Int. CI.7 I105K 1 14
(52) U.S. CI 174/259; 156/306.6
(57) ABSTRACT
Disclosed is a method for connecting microcircuits formed in a circuit board, such as a Tape Carrier Package (TCP), a Flexible Printed Circuit (FPC), a Liquid Crystal Display (LCD) or a printed circuit board using an anisotropic conductive adhesive including conductive particles, and the connection structure manufactured by the above method. The method comprises the steps of applying an insulating film layer to a circuit board having circuit patterns, and then boding them with an anisotropic conduction adhesive. The circuits that should not be connected by conductive particles included in the anisotropic conductive adhesive are prevented from a short-circuit
