High permeability composite films to reduce noise in high speed interconnects

(54) HIGH PERMEABILITY COMPOSITE FILMS TO REDUCE NOISE IN HIGH SPEED INTERCONNECTS

(75) Inventors: Leonard Forbes, Corvallis, OR (US);

Kie Y. Ahn, Chappaqua, NY (US);
Salman Akram, Boise, ID (US)

Correspondence Address:

Attn: Edward J. Brooks, III

Schwegman, Lundberg, Woessner & Kluth, P.A.

P.O. Box 2938

Minneapolis, MN 55402 (US) (73) Assignee: Micron Technology, Inc.

(21) Appl. No.: 10/910,676

(22) Filed: Aug. 3, 2004

Related U.S. Application Data

(62) Division of application No. 10/371,349, filed on Feb. 20, 2003, now Pat. No. 6,815,804, which is a division of application No. 10/099,020, filed on Mar. 13,2002.

Publication Classification

(51) Int. CI.7 H03K 17/16; H03K 19/003;

H01L 29/06

(52) U.S. C I 257 622

(57) ABSTRACT

An electronic system is provided with a structure for improved transmission line operation on integrated circuits. The structure for transmission line operation includes a first layer of electrically conductive material on a substrate. A first layer of insulating material is formed on the first layer of the electrically conductive material. A number of high permeability metal lines are formed on the first layer of insulating material. The number of high permeability metal lines includes composite hexaferrite films. A number of transmission lines is formed on the first layer of insulating material and between and parallel with the high permeability metal lines. A second layer of insulating material is formed on the transmission line and the pair of high permeability metal lines. The structure for transmission line operation includes a second layer of electrically conductive material on the second layer of insulating material.