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US007868440B2

(12) United States Patent ao) Patent No.: Us 7,868,440 B2

Roberts et al. (45) Date of Patent: Jan. 11,2011 Page 2

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Microdevices and methods for packaging microdevices. One embodiment of a packaged microdevice includes a substrate having a mounting area, contacts in the mounting area, and external connectors electrically coupled to corresponding contacts. The microdevice also includes a die located across from the mounting area and spaced apart from the substrate by a gap. The die has an integrated circuit and pads electrically coupled to the integrated circuit. The microdevice further includes first and second conductive elements in the gap that form interconnects between the contacts of the substrate and corresponding pads of the die. The first conductive elements are electrically connected to contacts on the substrate, and the second conductive elements are electrically coupled to corresponding pads of the die. The first conductive elements are attached to the second conductive elements at corresponding interfaces such that the interconnects connect the contacts of the substrate directly to corresponding pads on the die within the gap.

13 Claims, 3 Drawing Sheets

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6,603,210 B2* 8/2003 Kishimoto et al 257/781

6,607,937 Bl 8/2003 Corisis

6,622,380 Bl 9 2003 Grigg

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OTHER PUBLICATIONS

Riley, George A., Stud Bump Flip Chip, 4 pages, Dec. 2000, <http:// www.flipchips.com/tutorial03 .html>.

Cheah, L.K. et al., Thermosonic Flip Chip Assembly, 7 pages, Jun.

2001, <http://www.flipchips.com/tutorial09.html>.

Riley, George A., Flip Chip Interconnection for Detector Arrays, 6

pages, Jul. 2001, <http://www.flipchips.com/tutoriallO.html>.

Riley, George A., Gold Stud Bump Applications, 6 pages, Nov. 2002,

<http://www.flipchips.com/tutorial24.html>.

Riley, George A., Micro-Posts: Tall, Slender, Stud Bumps, 3 pages,

Apr. 2003, <http://www.flipchips.com/tutorial29.html>.

Riley, George A., Gold stud bump update, 6 pages, Mar. 2005,

<http://www/flipchips.com/tutorial50.html>.

* cited by examiner

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