PLANAR METAL INTERCONNECTION
SYSTEM AND PROCESS
Inventors: Kenneth Chang, Hopewell Junction;
George T. Chiu, Wappingers Falls,
both of N.Y.; Anthony Hoeg, Jr.,
Cary, N.C.; Linda H. Lee,
Poughkeepsie, N.Y.
Assignee: International Business Machines
Corporation, Armonk, N.Y.
Appl.No.: 165,537
Filed: Jul. 3, 1980
Int. CU G03C 5/00
U.S. CI 430/314; 156/643;
156/646; 156/656; 156/659.1; 156/661.1; 204/192 E; 430/316; 430/317; 430/318;
430/323; 430/324
Field of Search 430/314, 316, 317, 318,
430/323, 324; 156/643, 646, 655, 656, 659.1, 661.1; 204/192 E; 357/73
References Cited
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OTHER PUBLICATIONS
J. J. Colacino and T. A. Bartush, "Removal of Quartz Spikes Over Metal Lands," IBM TDB, vol. 20, No. 4, Sep. 1977, p. 1381.
Primary Examiner—Edward C. Kimlin
Attorney, Agent, or Firm—Henry Powers; Joseph C.
Redmond, Jr.; Theodore E. Galanthay
[57] ABSTRACT
A process for forming a layer of a metallurgy interconnection system on a substrate. The process involves forming a first electrically insulative layer of an organic polymerized resin material on the substrate, forming a second thin layer on the first layer which is resistant to dry etching conditions which are effective to etch the first layer, depositing a photoresist layer on the second layer, exposing the photoresist to form an inverse pattern of a desired metallurgy pattern and developing the photoresist, reactive ion etching the resultant exposed areas of the first and second layers, depositing a blanket continuous conductive metal layer over the hills and valleys of the pattern resulting from reactive ion etching, applying a planarizing photoresist layer, etching the photoresist to expose high spots of the metal layer, and etching the metal high spots to a depth sufficient to expose the surface of the second layer.
7 Claims, 15 Drawing Figures
