[54] METHOD OF FABRICATING AN ELECTRONIC CIRCUIT DEVICE
[75] Inventors: Toru Nishikawa; Ryohei Satoh;
Masahide Hara, all ol Yokohama;
Tetsuya Hayashida, Tokyo; Mitugu
Shirai, Hatano; Osamu Yamada,
Hiratsuka; Hiroko Takehara; Yasuhiro
Iwata, both ol Yokohama; Mitsunori
Tamura, Hatano; Masahito Ijuin,
Fujisawa, all ol Japan
[73] Assignee: Hitachi, Ltd., Tokyo, Japan
[21] Appl. No.: 761,430
[22] Filed: Dec. 6, 1996
Related U.S. Application Data
[63] Continuation-in-part of Ser. No. 578,054, Dec. 22, 1995, which is a continuation of Ser. No. 240,320, May 10, 1994, abandoned, which is a division of Ser. No. 890,255, May 29, 1992, Pat. No. 5,341,980, which is a continuation-in-part of Ser. No. 656,465, Feb. 19, 1991, abandoned.
[51] Int. CI. H05K 3/34
[52] U.S. CI 228/223; 228/180.22
[58] Field of Search 228/180.22, 205-207,
228/219-221, 223, 224; 148/23, 25; 29/841,
855-856
[56] References Cited
U.S. PATENT DOCUMENTS
5,129,962 7/1992 Gutierrez et al 148/23
5,564,617 10/1996 Degani et al 228/180.22
5,616,164 4/1997 Ochiai et al 75/342
FOREIGN PATENT DOCUMENTS
2-25291 1/1990 Japan . 2-290693 11/1990 Japan .
Primary Examiner—Samuel M. Heinrich
Attorney, Agent, or Firm—Fay, Sharpe, Beall, Fagan,
Minnich & McKee
[57] ABSTRACT
A method ol soldering used in labricating an electronic circuit device employs an organic material supplied to at least one ol the connecting members to be bonded. The connecting members are positioned in an oxidizing atmosphere, and heated in a nonoxidizing atmosphere to remove oxide and/or contamination layers present on the surface ol presoldered portions or metallized bonding portions. By this method, fluxless soldering is performed, positional shifts are reduced, and high reliability ol the soldering connections with reduction in residues alter reflow are obtained.
37 Claims, 5 Drawing Sheets
