Resin composites and method for producing the same

(54) RESIN COMPOSITES AND METHOD FOR PRODUCING THE SAME

(75) Inventors: Dong Dong Wang; Motoo Asai, both of Gifu (JP)

(73) Assignee: Ibiden Co., Ltd., Gifu (JP)

( * ) Notice: Subject to any disclaimer, the term of this patent is extended or adjusted under 35 U.S.C. 154(b) by 0 days.

(21) Appl. No.: 09/552,641

(22) Filed: Apr. 19, 2000

Related U.S. Application Data

(62) Division of application No. 09/258,199, filed on Feb. 26, 1999, now Pat. No. 6,124,408, which is a continuation of application No. 08/941,397, filed on Sep. 30,1997, now Pat. No. 5,994,480, which is a continuation of application No. 08/594,371, filed on Jan. 30, 1996, now abandoned, which is a continuation of application No. 08/200,522, filed on Feb. 23, 1994, now abandoned.

(30) Foreign Application Priority Data

Feb. 24, 1993 (JP) 5-58078

May 19, 1993 (JP) 5-139168

(51) Int. CI.7 C08F 283/00

(52) U.S. CI 525/523; 525/189; 525/534;

525/535

(58) Field of Search 525/523, 534,

525/535, 189

OTHER PUBLICATIONS

The Plastic Book, published by Plastics Age, pp. 162-63(1987).

Encyclopedia of Practical Plastics, published by Sangyo Chosakai, p. 455 (1993).

Yamanaka et al., Structure Development in Epoxy Resin Modified with Poly (ethersulphone), Polymer, 1989; vol. 30, Apr., pp. 662-667.

Youqing et al., Study on the Epoxy Resin System Modified Using Polyethersulphone, 34 the International SAMPE Symposium, May 8-11, 1989, pp. 875-883.

Bucknall et al., Phase Separation in Crosslinked Resins Containing Polymeric Modifiers, Polymer Engineering and Science Mid—Jan., 1986, vol. 26, No. 1, pp. 54-62. Database WPI, Derwent Publications Ltd. Derwent Abstract No. 85-033554 of JP 59226074, filed Dec. 19. 1994. Mackinnon et al., "A Dielectric, Mechanical, Rheological, and Electron Microscopy Study of Cure and Properties of a Thermoplastic-Modified Epoxy Resin", Macromolecules, 25, pp. 3492-3499 (1992).

English language translation of The Plastic Book (1987), from p. 162, col. 1, line 1 to col. 2, line 6.

* cited by examiner