INTEGRATED HEAT DISSIPATING
ASSEMBLY
Inventors: Yun-Yu Yeh, Zhonghe (TW);
Chia-Ming Tung, Taipei Hsien (TW);
Chien-Kai Lin, Banciao (TW)
Assignee: Xigmatek Co., Ltd (TW)
Notice: Subject to any disclaimer, the term of this patent is extended or adjusted under 35 U.S.C. 154(b) by 104 days.
Appl.No.: 11/592,187
Filed: Nov. 3, 2006
Prior Publication Data
US 2008/0105407 Al May 8, 2008
Int. CI.
H0SK 7/20 (2006.01)
H01L 23/36 (2006.01)
U.S. CI 361/700; 361/699; 361/701;
361/703; 165/80.4; 165/185; 257/714; 62/259.2
Field of Classification Search 361/687,
361/690,695-704,717-719; 62/259.2; 165/80.3, 165/80.4, 80.5, 104.25, 104.28, 104.33, 104.34, 165/121-126, 185, 104.31; 257/713-715, 257/718, 719, 722 See application file for complete search history.
References Cited
U.S. PATENT DOCUMENTS
An integrated heat dissipating assembly includes two heat sinks, a heat dissipating fan mounted between the two sinks and a body provided below the two heat sinks and the heat dissipating fan. The body is composed of a hollow body, a pump received inside the hollow body and a base attached to a bottom face of the hollow body for conducting heat from a heat source. The hollow body is divided into receiving spaces respectively communicating with water channels of the two heat sinks such that cooling water flowing inside the hollow body and the water channels of the two heat sinks is able to take away heat from the base. The heat is then dissipated by cool air due to the heat dissipating fan.
