United States Patent [19J pi] Patent Number: 4,629,548
Helmer [45] Date of Patent: Dec. 16,1986
U.S. Patent Dec. 16,1986 Sheet 1 of 3 4,629,548
[54] PLANAR PENNING MAGNETRON SPUTTERING DEVICE
[75] Inventor: John C. Helmer, Menlo Park, Calif.
[73] Assignee: Varian Associates, Inc., Palo Alto, Calif.
[21] Appl. No.: 719,182
[22] Filed: Apr. 3,1985
[51] Int. CI.4 C23C 15/00
[52] U.S. CI 204/298; 204/192.2
[58] Field of Search 204/298, 192 M
[56] References Cited
U.S. PATENT DOCUMENTS
2,146,025 2/1939 Penning 250/27.5
3,117,065 1/1964 Wootten 204/192 M
3,353,054 11/1967 Holland 313/178
3,412,310 11/1968 Quinn 321/15
3,447,072 5/1969 Sheldon 324/33
3,566,185 2/1971 Gavin . 315/111
3,898,496 8/1975 Hudson et al 313/62
4,282,083 8/1981 Kertesz et al 204/298
4,324,631 4/1982 , Meckel et al 204/192 M
4,344,019 8/1982 Gavin etal 315/111.81
4,391,697 7/1983 Morisson 204/298
4,401,546 8/1983 Nakamura et al. 204/298
4,412,907 11/1983 Itoetal 204/298
4,414,087 11/1983 Meckel 204/298
4,431,505 2/1984 Morrison 204/298
4,448,653 5/1984 Wegmann 204/298
4,500,409 2/1985 Boys et al 204/192 R
4,564,435 1/1986 Wickersham 204/192 R
4,576,700 3/1986 Kadokura 204/298
OTHER PUBLICATIONS
"Magnetron Sputtering Sources for Ferromagnetic Material", J. Vac. Sci. Technol. A 3(1), Jan./Feb. 1985, pp. 10-13-B. Window and F. Sharpies.
Primary Examiner—Arthur P. Demers
Attorney, Agent, or Firm—Terrance Dooher; Stanley Z.
Cole
[57] ABSTRACT
An improved magnetron sputter source particularly suitable for magnetic materials is provided in the forming of an unfolded Penning discharge source. The two cathodes are in the form of an inner cathode roughly coplanar with an outer cathode ring. An anode radially between the cathodes is raised above the cathode surfaces so as to block line of sight from the inner cathode surface to the outer. A magnetic flux vector is imposed which passed from one cathode surface to the other. Raising the anode surface about one-fourth inch above the cathode surfaces allows raising the applied voltage so that a source of 5 kilowatts or greater is possible. Raising the anode also spreads the distribution of discharge more uniformly over the target surface and permits low pressure operation thereby facilitating good adhesion and uniform coverage of the substrate.
6 Claims, 5 Drawing Figures
