A method and apparatus for packaging a semiconductor die with an interposer substrate. The semiconductor device assembly includes a conductively bumped semiconductor die and an interposer substrate having multiple recesses formed therein. The semiconductor die is mounted to the interposer substrate with...http://www.google.de/patents/US7161237?utm_source=gb-gplus-sharePatent US7161237 - Flip chip packaging using recessed interposer terminals
Flip chip packaging using recessed interposer terminals
