Chambers, systems, and methods for electrochemically processing microfeature ...

OTHER PUBLICATIONS

U.S. Appl. No. 60/182,160, McHugh et al.
U.S. Appl. No. 60/206,663, Wilson et al.
U.S. Appl. No. 60/294,690, Gibbons et al.
U.S. Appl. No. 60/316,597, Hanson.
U.S. Appl. No. 60/607,046, Klocke.
U.S. Appl. No. 60/607,460, Klocke.

Patent Abstract of Japan, "Plating Method" Publication No. 57171690, Publication Date: Oct. 22, 1982.

Patent Abstract of Japan, English Abstract Translation—Japanese
Utility Model No. 2538705, Publication Date: Aug. 25, 1992.
Ritter et al., "Two- and Three-Dimensional Numberical Modeling of
Copper Electroplating For Advanced ULSI Metallization," E-MRS
Conference, Symposium M, Basic Models to Enhance Reliability;
Strasbourg (France), 1999.

Ritter et al., "Two- Three-Dimensional Numberical Modeling of
Copper Electroplating For Advanced ULSI Metallization," E-MRS
Conference Symposium M. Basic Models to Enhance Reliability,
Strabourg (France) 1999.

Ritter, G., et al., "Lwo-And Three-Dimensional Numerical Modeling of Copper Electroplating For Advanced ULSI Metallization," Jun. 1999, 13 pgs, E-MRS Conference Symposium M. Basic Models to Enhance Reliability, Strasbourg, France.

Singer, P., "Copper Goes Mainstream: Low k to Follow," Semiconductor International, pp. 67-70, Nov. 1997.

Office Action issued by the Japanese Patent Office on May 26, 2008 in Japanese Patent Application No. 2003-500322. Contolini et al., "Copper Electroplating Process for Sub-Half-Micron ULSI Structures," VMIC Conference 1995 ISMIC—04/95/0322, pp. 322-328, Jun. 17-29, 1995.

Devaraj et al., "Pulsed Electrodeposition of Copper," Plating & Surface Finishing, pp. 72-78, Aug. 1992.

Dubin, "Copper Plating Techiques for ULSI Metallization," Advanced MicroDevices.

Dubin, V.M., "Electrochemical Deposition of Copper for On-Chip Interconnects," Advanced MicroDevices.

Gauvin et al., "The Effect of Chloride Ions on Copper Deposition," J. of Electrochemical Society, vol. 99, pp. 71-75, Feb. 1952. International Search Report for PCT/US02/17840; Applicant: Semitool, Inc., Mar. 3, 2003, 4 pgs.

International Search Report for PCT/US02/28071; Applicant: Semitool, Inc., Dec. 13, 2002, 4 pgs.

International Search Report PCT/US02/17203; Semitool, Inc., Dec. 31, 2002, 4 pgs.

Lee, Tien-Yu Tom et al., "Application of a CFD Tool in Designing a Fountain Plating Cell for Uniform Bump Plating of Semiconductor Wafers," IEEE Transactions On Components, Packaging and Manufacturing Technology—Part B, Feb. 1996, pp. 131-137, vol. 19, No. 1,IEEE.

Lee, Tien-Yu Tom et al., "Application of a CFD Tool in Designing a Fountain Plating Cell for Uniform Bump Plating of Semiconductor Wafers," IEEE Transactions on Components, Packaging and Manufacturing Technology, Feb. 1996, pp. 131-137, vol. 19, No. 1. Lee, Tien-Yu Tom, "Application of a CFD Tool in Designing a Fountain Plating Cell for Uniform Bump Plating of Semiconductor Wafers," IEE Transactions on Components, Packaging, and Manufacturing Technology (Feb. 1996), vol. 19, No. 1, IEEE. Lowenheim, F.A., "Electroplating," Jan. 1979, 12 pgs, McGraw-Hill Book Company.

Lowenheim, Frederick A., "Electroplating," Jan. 1979, 12 pgs, McGraw-Hill Book Company, USA.

Lowenheim, Frederick A., "Electroplating Electrochemistry Applied to Electroplating," 1978, pp. 152-155, McGraw-Hill BookCompany, New York.

Ossro, N.M., "An Overview of Pulse Plating," Plating and Surface Finishing, Mar. 1986.

Passal, F., "Copper Plating During the Last Fifty Years," Plating, pp. 628-638, Jun. 1959.

Patent Abstract of Japan, "Organic Compound and its Application"
Publication No. 08-003153, Publication Date: Jan. 9, 1996.
Patent Abstract of Japan, "Partial Plating Device," Publication No.
01234590, Publication Date: Sep. 19, 1989.

* cited by examiner