About 114 results
|An electronic component is disclosed including a plurality of semiconductor |
packages soldered together in a side-by-side configuration. The packages (160a,
160b) are batch processed on a substrate panel (100). The panel includes a
plurality of through-holes (120) drilled through the panel and ...
|A strip (40) on which a plurality of integrated circuit package outlines (42) may be |
fabricated 'within a plurality of process tools. The strip includes one or more
fiducial, notches (44) and/or guide pin notches (46) formed in an outer edge of
the strip. The one or more fiducial and/or guide pin notches allow a ...
|A single-lid flash memory card and methods of manufacturing same are |
disclosed. The single-sided lid flash memory card may be formed from a
semiconductor package having two or more tapered, stepped or otherwise
shaped edges capable of securing a single-sided lid thereon. The taper, step or
|A warpage-preventive circuit board and method for fabricating the same is |
provided, wherein a plurality of conductive traces are formed on a surface of an
electrically-insulative core layer, and a plurality of discontinuous dummy circuit
regions are disposed on the surface of the ...
|A method of reducing mechanical stress on an integrated circuit is disclosed |
including applying solder columns to the substrate for adding structural support to
the package during the fabrication process.
|A strengthened semiconductor die substrate and package are disclosed. The |
substrate may include contact fingers formed with nonlinear edges. Providing a
nonlinear contour to the contact finger edges reduces the mechanical stress
exerted on the semiconductor die which would otherwise occur with ...
|A printed circuit board is disclosed having coextensive electrical connectors and |
contact pad areas. Areas of the contact pads where the traces and/or vias are
located may be etched away to ensure electrical isolation between the traces,
vias and contact pads.
|A portable memory card and methods of manufacturing same are disclosed. The |
portable memory includes a substrate having a plurality of holes formed therein.
During the encapsulation process, mold compound flows over the top surface of
the substrate, through the holes, and down into a recessed ...
|A semiconductor device having a redistribution layer, and methods of forming |
same, are disclosed. After fabrication of semiconductor die on a wafer, a tape
assembly is applied onto a surface of the wafer, in contact with the surfaces of
each semiconductor die on the wafer. The tape assembly includes a ...
|A semiconductor package is disclosed including a substrate, a solder mask layer, |
one or more semiconductor die mounted to the solder mask layer and electrically
coupled to the substrate, and a glob top cover over the semiconductor die. The
solder mask further includes a dam protruding above ...