CN102026518B - Substrate support device - Google Patents
Substrate support device Download PDFInfo
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- CN102026518B CN102026518B CN201010268848.4A CN201010268848A CN102026518B CN 102026518 B CN102026518 B CN 102026518B CN 201010268848 A CN201010268848 A CN 201010268848A CN 102026518 B CN102026518 B CN 102026518B
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- circuit substrate
- bracket
- support chip
- support
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Abstract
The invention aims at providing a substrate supporting device which is capable of properly assembling a circuit substrate without increasing extra cost relative to assembly positions of different circuit substrates because of different electric apparatuses. The substrate supporting device comprises a base (1) and the circuit substrate (3), a plurality of supporting sheets (21) which are made of the same material as the circuit substrate (3) and dispersed between the base (1) and the circuit substrate (3), a first holder (22) which is provided with a mounting surface (22c) fixed at the base (1) and fastened at each base end of the support sheets (21), and a second holder (23)which is provided with a supporting surface (23c) for fixing and supporting the circuit substrate (3) and fastened to each front end of the support sheet (21), wherein the support sheet (21) is so configured that at least one support sheet is crossed with other support sheets (21) in a thickness direction.
Description
Technical field
The present invention relates to the baseplate support device for assembling circuit substrate on electronic equipment Nei fixed position.
Background technology
In general, in the electronic equipments such as audio devices, be assembled with the circuit substrate of the control use that various electronic units (circuit block) are installed.Circuit substrate exist the base be directly installed on electronic equipment situation or and base between by the fixing situation of sheet metal member etc., although but be all called electronic equipment, but according to the difference of machine, its form or internal structure are also varied, therefore via sheet metal member by electric circuit base board assembling to the situation of base, can share existing sheet metal member situation seldom.Therefore, must make for by the mould of sheet metal member moulding according to each machine, be difficult to suppress product cost.
On the other hand, do not use this sheet metal member, two substrate in combination are met at right angles, the structure of utilizing a side substrate (vertical printed base plate) to support the opposing party's substrate (horizontal printed base plate) be in the public eye (for example patent documentation 1).
But in patent documentation 1, the base of vertical printed base plate is fixed on main substrate by connector, therefore by outside in the larger situations such as impulsive force of vertical printed base plate effect, there is the danger of connector breakage.
In addition, vertical printed base plate only combines by the protuberance that is formed at a part for vertical printed base plate being embedded to the slotted hole of a part that is formed at horizontal printed base plate with horizontal printed base plate, therefore only utilizes vertical printed base plate to be difficult to suitably support level printed base plate.
In addition, in documents 1, below horizontal printed base plate, be provided with the structure that is called as " tuner pack ", horizontal printed base plate and this " tuner pack " combination, but in not there is not the electronic equipment of this structure, must make separately the support component and the mould thereof that are equivalent to " tuner pack ", consequently be difficult to realize the reduction of cost.
Summary of the invention
The present invention is in view of above problem, and its object is the assembling position of the circuit substrate different with respect to the machine because of electronic equipment, can not increase suitably assembling circuit substrate of unnecessary one-tenth this locality.
The present invention in order to achieve the above object, provides a kind of baseplate support device 2, it is characterized in that, comprising: base 1 and circuit substrate 3; A plurality of support chips 21, the plurality of support chip is formed by the material identical with foregoing circuit substrate 3, and decentralized configuration is between above-mentioned base 1 and circuit substrate 3; The first bracket 22, this first bracket has the installed surface 22c at the position of being fixed on above-mentioned base 1, is fastened on each base end part of above-mentioned support chip 21; And second bracket 23, this second bracket has the supporting surface 23c of fixed support foregoing circuit substrate 3, is fastened on each leading section of above-mentioned support chip 21, and above-mentioned support chip 21 is configured to one of them support chip and intersects on thickness direction with other support chips 21.
In addition, it is characterized in that, above-mentioned the first bracket 22 and the second bracket 23 are electric conductors, and the surface of above-mentioned support chip 21 tightens intrinsic metal raised line 24a, and this metal raised line 24a is connected above-mentioned the first bracket 22 along the long side direction of above-mentioned support chip 21 with the second bracket 23 conductions.
And, it is characterized in that, on the front end of above-mentioned support chip 21, be formed with protuberance 21a more outstanding than the supporting surface 23c of above-mentioned the second bracket 23 and embedding location hole 31, this location hole 31 is bored a hole in the position of foregoing circuit substrate 3.
And then, it is characterized in that, above-mentioned support chip 21 blocks and forms from the substrate raw sheet B1 that comprises foregoing circuit substrate 3.
According to the present invention, a plurality of support chips with decentralized configuration between base and circuit substrate, and the first bracket that is fastened on each base end part of support chip is fixed on the position of base, by being fastened on the second bracket fixed support circuit substrate of each leading section of support chip, therefore by above-mentioned support chip, circuit substrate can be without being suitably assembled on base reelingly, and being configured at least one support chip in each support chip intersects on thickness direction with other support chips, therefore support chip has larger shock resistance as a whole, resistance to impact, even also support circuit substrate stably in the situation that having impulsive force from external action.
In addition, support chip blocks and forms from the substrate raw sheet that comprises the circuit substrate that should support, therefore do not need only in order to form support chip, to make mould or buying metallic sheet material, the support chip because of the different circuit substrate of each machine and assembling position thereof can be guaranteed to meet, and then component costs and production cost can be cut down significantly.
In addition; on the surface of support chip, be formed with the metal raised line along its long side direction; in the structure the first bracket consisting of electric conductor being connected with the second bracket conduction by this metal raised line; make electrostatic grounding charged on circuit substrate; thus can protective circuit parts be subject to the infringement of static; and by metal raised line, strengthen support chip, can improve its durability.
In addition, at the front end of support chip, be formed with protuberance, at this protuberance, embed through in the structure of location hole at position of circuit substrate, can easily and suitably to the fixed position of circuit substrate, assemble.
Accompanying drawing explanation
Fig. 1 means the perspective view of the configuration pattern of support chip.
Fig. 2 means the plane skeleton diagram of the substrate raw sheet that is formed with circuit substrate.
Fig. 3 is the part enlarged drawing of substrate raw sheet.
Fig. 4 means the perspective exploded view of an embodiment of the invention.
Fig. 5 means the perspective view of the support chip that is fastened with bracket.
Fig. 6 means the side skeleton diagram of modification of the present invention.
Fig. 7 means the plane skeleton diagram of other modifications of the present invention.
Embodiment
Below, based on accompanying drawing, describe an embodiment of the invention in detail.First, in Fig. 1, the 1st, the base plate of the base of formation electronic equipment.Base plate obtains metallic plate punch forming, thereon via the predetermined circuit substrate 3 of baseplate support device 2 assembling.
By decentralized configuration, a plurality of support chips 2 on base plate 1 and the bracket 22,23 that is fastened on the long side direction both ends of above-mentioned support chip 21 form baseplate support device 2.A plurality of support chips 21 are of similar shape (in illustrated example, being L font) and size (length), the protuberance 21a that stands in great numbers and be formed with narrowed width and form on base plate 1 Shang，Qi Ge one end (front end).
In addition, in illustrated example, upper and lower a pair of bracket 22,23 is コ font, the bracket 22 (the first bracket) that is wherein fastened on the Ge Yi end (base end part) of support chip 21 is fixed on and support chip 21 should be remained on the base plate 1 of erectility, is fastened on other the bracket 23 (the second bracket) of Ge Yi end (leading section) of support chip 21 for fixed support circuit substrate 3.
Fig. 2 represents to be assembled into the interior circuit substrate 3,4 before of electronic equipment.In Fig. 2, B1, B2 are respectively the raw sheets of setting, on a side substrate raw sheet B1, are formed with circuit substrate 3, on the opposing party's substrate raw sheet B2, are formed with circuit substrate 4.Particularly, on substrate raw sheet B1, B2, except circuit substrate 3,4, on the remainder m outside the range of distribution of circuit substrate 3,4, be formed with respectively a plurality of above-mentioned support chips 21. Circuit substrate 3,4 or supporting bracket 21 can be utilized existing processing machine, enter as illustrated in fig. 3 incision line S on substrate raw sheet B1, B2, are breaking in this incision line S partly residual small pieces f, thereby can easily from substrate raw sheet B1, B2, block.
So, in illustrated example, on 2 substrate raw sheet B1, B2, be formed with respectively a plurality of support chips 21, but the present invention is not limited to this, also can on a substrate raw sheet B 1, form a plurality of circuit substrates 3,4 and a plurality of support chip 21, or the in the situation that of also can assembling a circuit substrate 3 in an electronic equipment, on a substrate raw sheet B1, form circuit substrate 3 and support necessary a plurality of support chip 21.In addition, in Fig. 2 and Fig. 3, shade does not also mean that section, but for for expressing circuit substrate 3,4 or support chip 21.
At this, cut out former the going out of use of remainder m of substrate raw sheet B1, the B2 of circuit substrate 3,4, utilize in the present invention this remainder m to form a plurality of support chips 21, this each support chip 21 is blocked from substrate raw sheet B1, B2, for assembling circuit substrate 3 in electronic equipment, therefore with utilize the mould of making separately in the past, the situation that is equivalent to the sheet metal member moulding of support chip 21 was compared, do not need only in order to form support chip 21, to make mould or buying metallic sheet material, therefore can cut down significantly component costs or production cost.
Then,, in Fig. 4, on bracket 22,23, on its both sides face 22a, 23a separately, be formed with tab 22b, 23b.To this, on support chip 21, be equipped with the cut hole 21b corresponding with tab 22b, the 23b of bracket 22,23, by insert tab 22b, 23b in this cut hole 21b, form bracket 22,23 structure fastening with respect to support chip 21.
In addition, the securing installed surface 22c of bottom surface sections clipping about bracket 22，You Qi both sides face 22a is formed with screwed hole 22d on this installed surface 22c.And, described bracket 22 by by hold-down screw 5 by this screwed hole 22d and be screwed in the screwed hole 1a of the base plate 1 that is formed at base, fixing with respect to base plate 1.
On the other hand, the upper face clipping about bracket 23，You Qi both sides face 23a is as the supporting surface 23c for fixed support circuit substrate 3.On this supporting surface 23c, be formed with the screwed hole 23d corresponding with being located in above-mentioned diameter holes 32 on circuit substrate 3, by by hold-down screw 6 by diameter holes 32 and be screwed in this screwed hole 23d, circuit substrate 3 is fixing with respect to bracket 23.
In addition, the raised part 21a that is formed at the front end of support chip 21 gives prominence to upward than the supporting surface 23c of bracket 23, when this protuberance 21a is inserted to the location hole 31 of circuit substrate 3, when circuit substrate 3 occupies on the supporting surface 23c of bracket 23, screwed hole 23d and diameter holes 32 are communicated with.And bracket 22,23 is the electric conductor consisting of metallic plate as common component, even in the different electronic equipment of machine, can be fastened on the support chip blocking from substrate raw sheet and realizes shared according to each machine.
Secondly, as can be clearly found out in Fig. 5, on support chip 21, on the surface of the contrary rear side of the face with being fastened with bracket 22,23, be fastened with several (being 3 in illustrated example) metal raised line 24a, 24b along its long side direction.These metal raised lines 24a, 24b are bonding and form by tin or other metals or its alloy molten, and the rib that is 10～100 μ m left and right as the thickness of strengthening support chip 21 works.In addition, each support chip 21 as shown in Figure 1, one of them (in illustrated example, being the support chip 21 that stands in the central portion of base plate 1) is configured on thickness direction across with other support chips 21, therefore, each support chip 21 has larger shock resistance, resistance to impact as a whole, can stably continue support circuit substrate 3.
In addition, the metal raised line 24a of Tu5Zhong， both sides connects upper and lower a pair of bracket 22,23 conductions by tab 22b, 23b.Thus, on circuit substrate 3, the bracket 22 by bottom is directed to base plate 1 from the bracket 23 on top for charged static, can protect the circuit block being arranged on circuit substrate 3 not to be subject to the infringement of static.That is, metal raised line 24a also can be used as ground connection distribution and works, but also can utilize metal raised line 24a, and to circuit substrate, 3 power supplies are used.
In addition, tab 22b, the 23b of preferred carriage 22,23 and the cut hole 21b brute force of support chip 21 are chimeric, can not throw off easily after chimeric, but more strongly fastening in the situation that, for example, can adopt following methods.
First, on substrate raw sheet B1, B2 before cutting out support chip 21, in pattern plane, the surrounding of the cut hole 21b of tab 22b, the 23b of chimeric bracket 22,23 forms the pattern that can adhere to scolding tin in advance.The 24a of Fig. 5 is equivalent to its pattern.
On the other hand, on substrate raw sheet B1, B2, before scolding tin adheres to operation, on the face of opposition side of pattern plane of part that becomes support chip 21, in advance tab 22b, the 23b of bracket 22,23 inserted to cut hole 21b and install.
And the pattern plane that makes to be provided with substrate raw sheet B1, the B2 of bracket 22,23 contacts with the melting scolding tin being contained in scolding tin chute, adheres to scolding tin on the pattern being formed in pattern plane.At this scolding tin, adhere in operation, be located at cut hole 21b pattern around with tab 22b, 23b from the outstanding bracket 22,23 of this cut hole 21b by scolding tin and integrated, by bracket 22,23 and support chip 21 combinations.And, from substrate raw sheet B1, B2, cut out support chip 21.
Above an embodiment of the invention represented in the accompanying drawings and be illustrated.Support chip 21 is not limited to one of them and erects configuration in plate face direction (thickness direction) difference, also can be that whole support chip 21 is respectively with respect to being configured across in other support chips 21Ban Mian aspect, the crossing condition of thickness direction is not limited to quadrature, can be also oblique.
In addition, it is all identical length that each support chip 21 is not limited to, and for example as shown in Figure 6, base plate 1 is in the situation with the parts of step, and support chip 21 blocks out two kinds of situations of length L 1 and length L 2 from substrate raw sheet.
And then, support chip 21 is not limited to stand in the situation on the base plate 1 that forms base, for example as shown in Figure 7, and also can be with respect to the side plate 11 of the base with base plate 1 quadrature, each support chip 21 is fixed into right angle by bracket 22, is the vertical position parallel with side plate 11 by circuit substrate 3 fixed supports.
Claims (4)
1. a baseplate support device, is characterized in that, comprising:
Base and circuit substrate;
A plurality of support chips, the plurality of support chip is formed by the material identical with foregoing circuit substrate, and decentralized configuration is between above-mentioned base and foregoing circuit substrate;
The first bracket, this first bracket has the installed surface at the position of being fixed on above-mentioned base, is fastened on each base end part of above-mentioned support chip; And
The second bracket, this second bracket has the supporting surface of fixed support foregoing circuit substrate, is fastened on each leading section of above-mentioned support chip,
Above-mentioned support chip is configured to one of them support chip and intersects on thickness direction with other support chips.
2. baseplate support device according to claim 1, is characterized in that,
Above-mentioned the first bracket and the second bracket are electric conductors, and the surface of above-mentioned support chip tightens intrinsic metal raised line, and this metal raised line is connected above-mentioned the first bracket along the long side direction of above-mentioned support chip with the second bracket conduction.
3. baseplate support device according to claim 1 and 2, is characterized in that,
On each front end of above-mentioned support chip, be formed with protuberance more outstanding than the supporting surface of above-mentioned the second bracket and embedding location hole, this location hole is bored a hole in the position of foregoing circuit substrate.
4. baseplate support device according to claim 1 and 2, is characterized in that,
Above-mentioned support chip blocks and forms from the substrate raw sheet that comprises foregoing circuit substrate.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009-210406 | 2009-09-11 | ||
| JP2009210406A JP5257786B2 (en) | 2009-09-11 | 2009-09-11 | Substrate support device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102026518A CN102026518A (en) | 2011-04-20 |
| CN102026518B true CN102026518B (en) | 2014-01-15 |
Family
ID=43867155
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010268848.4A Active CN102026518B (en) | 2009-09-11 | 2010-08-30 | Substrate support device |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP5257786B2 (en) |
| CN (1) | CN102026518B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1215254A (en) * | 1997-10-16 | 1999-04-28 | 阿尔卑斯电气株式会社 | Electronic equipment |
| US5900920A (en) * | 1994-05-30 | 1999-05-04 | Samsung Electronics Co., Ltd. | Apparatus for affixing a printed circuit board in a monitor |
| CN200969067Y (en) * | 2006-10-25 | 2007-10-31 | 鸿富锦精密工业（深圳）有限公司 | Wire frame fixing device |
| CN201123197Y (en) * | 2007-12-03 | 2008-09-24 | 冠捷投资有限公司 | Substrate fixing member |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08195568A (en) * | 1995-01-17 | 1996-07-30 | Nippondenso Co Ltd | Electronic device and method of assembling |
| JP2002290075A (en) * | 2001-03-27 | 2002-10-04 | Densei Lambda Kk | Supporting tool for substrate and circuit arrangement having the supporting tool for substrate |
| JP2007059753A (en) * | 2005-08-26 | 2007-03-08 | Fuji Xerox Co Ltd | Printed circuit board fixing member |
| JP5080800B2 (en) * | 2006-12-25 | 2012-11-21 | パナソニックエコソリューションズ電路株式会社 | Distribution board |
-
2009
- 2009-09-11 JP JP2009210406A patent/JP5257786B2/en active Active
-
2010
- 2010-08-30 CN CN201010268848.4A patent/CN102026518B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5900920A (en) * | 1994-05-30 | 1999-05-04 | Samsung Electronics Co., Ltd. | Apparatus for affixing a printed circuit board in a monitor |
| CN1215254A (en) * | 1997-10-16 | 1999-04-28 | 阿尔卑斯电气株式会社 | Electronic equipment |
| CN200969067Y (en) * | 2006-10-25 | 2007-10-31 | 鸿富锦精密工业（深圳）有限公司 | Wire frame fixing device |
| CN201123197Y (en) * | 2007-12-03 | 2008-09-24 | 冠捷投资有限公司 | Substrate fixing member |
Non-Patent Citations (1)
| Title |
|---|
| JP特开2008-160998A 2008.07.10 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102026518A (en) | 2011-04-20 |
| JP5257786B2 (en) | 2013-08-07 |
| JP2011061065A (en) | 2011-03-24 |
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Owner name: JVC KENWOOD CORPORATION Free format text: FORMER OWNER: VICTORY CO. LTD. Effective date: 20140228 |
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| TR01 | Transfer of patent right |
Effective date of registration: 20140228 Address after: Kanagawa Patentee after: JVC Kenwood Corp. Address before: Kanagawa Patentee before: Victory Co., Ltd. |