WO2000030210A1 - Smartcard module and method of attaching antenna wires thereto - Google Patents

Smartcard module and method of attaching antenna wires thereto Download PDF

Info

Publication number
WO2000030210A1
WO2000030210A1 PCT/US1999/023807 US9923807W WO0030210A1 WO 2000030210 A1 WO2000030210 A1 WO 2000030210A1 US 9923807 W US9923807 W US 9923807W WO 0030210 A1 WO0030210 A1 WO 0030210A1
Authority
WO
WIPO (PCT)
Prior art keywords
lead frame
groove
frame layer
antenna wire
module
Prior art date
Application number
PCT/US1999/023807
Other languages
French (fr)
Inventor
Kiron Gore
Original Assignee
Motorola Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc. filed Critical Motorola Inc.
Publication of WO2000030210A1 publication Critical patent/WO2000030210A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/04—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the shape
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07786—Antenna details the antenna being of the HF type, such as a dipole
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09745—Recess in conductor, e.g. in pad or in metallic substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • This application relates to contactless smartcards and, more particularly, to a method of attaching antenna wires to such smartcards.
  • Contactless smartcards contain an antenna inlay sheet, with multiple sites per sheet, and a module attached to each site.
  • the inlay sheet is then laminated with two outer sheets.
  • the module is completely buried within the thickness of a 0.030 inch (+/- 0.003 inch) card.
  • the outer sheets could be pre-printed or left blank and printed as a single card.
  • the antenna could be embedded in, etched on or printed on a plastic inlay sheet. A cutout is punched in this inlay to make room for the smartcard module.
  • the ends of the antenna are then attached to the smartcard module.
  • the module contains an IC silicon that is glued and then wire bonded to a metal lead frame. This assembly is then over- molded to protect the IC silicon and its wire bonds.
  • FIGS. 1-3 show several conventional solutions. In each case, two ends of the antenna are attached to these two leads.
  • plastic material softens and tries to fill all voids. Large air gaps above the leads or around the module body cause a large dip in the plastic surface. This is shown in FIG. 4. This affects the single card printing operation, which requires the surface to be perfectly flat. If the outer sheets are pre-printed, a shadow of the module is seen through, because the topography of the plastic is disturbed when plastic flows in to fill the air gaps.
  • FIG. 1 depicts the result of dispensing filler material and trying to fill all the air gaps.
  • the problem with this technique is it requires a second sheet on the bottom to contain the liquid filler material. This adds to the total thickness of the inlay and reduces the thickness of the outer printed sheets. Reduced thickness on outer sheets affects printing quality. Filler material choice is also a challenge. It needs to have low viscosity for dispensing, material needs to be compatible with plastic and have no volatile ingredients that may get trapped during lamination and cause blistering. The dispensed volume also needs to be accurately controlled.
  • FIG. 2 depicts the result of using two sheets with thickness that match the lead frame and the overmold. Each sheet also has different punch patterns that match the outline of the lead frame and over-mold.
  • the problem with this technique is the inaccuracy of aligning the two punched sheets. These inaccuracies require a large clearance between punched hole and the object within. This clearance results in large air gaps that will exhibit show through after lamination.
  • FIG. 3 depicts the result of adding a process step of pre-lamination where two thin plastic sheets are laminated to the inlay. Plastic material from these sheets acts as filler and smoothens out the surface profile. This process minimizes the module show through at final lamination. This additional process adds cost. It also increases the thickness of the inlay and reduces the thickness of the outer printed sheets. Reduced thickness on outer sheet affects printing quality.
  • FIG. 4 depicts the result of avoiding using high gloss finish on the cards after lamination. Using a "matte" finish plate during lamination will yield a rough looking surface that hides the shadow effect of the module showing through. This compromises aesthetics.
  • FIGS. 1-4 depict prior art.
  • FIG. 5A comprises top and cross-section views of a first embodiment of a smartcard module 600 arranged in accordance with the invention.
  • FIG. 5B is a top view of the smartcard module 600 of FIG. 5A with antenna wires 625 and 635 attached thereto.
  • FIG. 6 is an enlarged cross-section view of the smartcard module 600.
  • FIG. 7 is a block diagram of a smartcard 701 including the smartcard module 600.
  • a smartcard module 600 has a lead frame layer 621 , 631 , the lead frame layer having a lead frame layer surface 627, 637 with a groove 623, 633 formed therein.
  • the groove has a groove cross section extending inside the lead frame layer.
  • An antenna wire 625, 635 is mounted within the groove.
  • the antenna wire has an antenna wire cross section with a shape and thickness closely matching the groove cross section so that the uppermost portion of the antenna wire is substantially co-planar with the lead frame layer surface.
  • the smartcard module 600 includes a lead frame layer 621 , 631 , the lead frame layer having a lead frame surface 627, 637. Also shown is a silicon integrated circuit 601 coupled 603, 605 to the lead frame layer.
  • the lead frame layer 621 , 631 is disposed on an epoxy layer 607.

Abstract

A smartcard module (600) has a lead frame layer (621, 631), the lead frame layer having a lead frame layer surface (627, 637) with a groove (623, 633) formed therein. The groove has a groove cross section extending inside the lead frame layer. An antenna wire (625, 635) is mounted within the groove. The antenna wire has an antenna wire cross section with a shape and thickness closely matching the groove cross section so that the uppermost portion of the antenna wire is substantially co-planar with the lead frame layer surface.

Description

SMARTCARD MODULE AND METHOD OF ATTACHING ANTENNA WIRES THERETO
Reference to Prior Provisional Application The applicant hereby claims the priority benefit of prior provisional application serial number 60/108,073 filed 12 November 1998, by Kiron P. Gore, the same inventor as in the present application, and the disclosure of which prior provisional application is hereby incorporated by reference verbatim, with the same effect as though such disclosure were fully and completely set forth herein.
Field of the Invention This application relates to contactless smartcards and, more particularly, to a method of attaching antenna wires to such smartcards.
Background of the Invention Contactless smartcards contain an antenna inlay sheet, with multiple sites per sheet, and a module attached to each site. The inlay sheet is then laminated with two outer sheets. The module is completely buried within the thickness of a 0.030 inch (+/- 0.003 inch) card. The outer sheets could be pre-printed or left blank and printed as a single card. The antenna could be embedded in, etched on or printed on a plastic inlay sheet. A cutout is punched in this inlay to make room for the smartcard module. The ends of the antenna are then attached to the smartcard module. The module contains an IC silicon that is glued and then wire bonded to a metal lead frame. This assembly is then over- molded to protect the IC silicon and its wire bonds. The metal lead frame extends beyond the over mold and forms two leads. FIGS. 1-3 show several conventional solutions. In each case, two ends of the antenna are attached to these two leads. During final lamination, plastic material softens and tries to fill all voids. Large air gaps above the leads or around the module body cause a large dip in the plastic surface. This is shown in FIG. 4. This affects the single card printing operation, which requires the surface to be perfectly flat. If the outer sheets are pre-printed, a shadow of the module is seen through, because the topography of the plastic is disturbed when plastic flows in to fill the air gaps.
FIG. 1 depicts the result of dispensing filler material and trying to fill all the air gaps. The problem with this technique is it requires a second sheet on the bottom to contain the liquid filler material. This adds to the total thickness of the inlay and reduces the thickness of the outer printed sheets. Reduced thickness on outer sheets affects printing quality. Filler material choice is also a challenge. It needs to have low viscosity for dispensing, material needs to be compatible with plastic and have no volatile ingredients that may get trapped during lamination and cause blistering. The dispensed volume also needs to be accurately controlled.
FIG. 2 depicts the result of using two sheets with thickness that match the lead frame and the overmold. Each sheet also has different punch patterns that match the outline of the lead frame and over-mold. The problem with this technique is the inaccuracy of aligning the two punched sheets. These inaccuracies require a large clearance between punched hole and the object within. This clearance results in large air gaps that will exhibit show through after lamination.
FIG. 3 depicts the result of adding a process step of pre-lamination where two thin plastic sheets are laminated to the inlay. Plastic material from these sheets acts as filler and smoothens out the surface profile. This process minimizes the module show through at final lamination. This additional process adds cost. It also increases the thickness of the inlay and reduces the thickness of the outer printed sheets. Reduced thickness on outer sheet affects printing quality.
FIG. 4 depicts the result of avoiding using high gloss finish on the cards after lamination. Using a "matte" finish plate during lamination will yield a rough looking surface that hides the shadow effect of the module showing through. This compromises aesthetics. Brief Description of the Drawings FIGS. 1-4 depict prior art.
FIG. 5A comprises top and cross-section views of a first embodiment of a smartcard module 600 arranged in accordance with the invention.
FIG. 5B is a top view of the smartcard module 600 of FIG. 5A with antenna wires 625 and 635 attached thereto.
FIG. 6 is an enlarged cross-section view of the smartcard module 600. FIG. 7 is a block diagram of a smartcard 701 including the smartcard module 600.
Description of the Preferred Embodiments Briefly, in accordance with the present invention and with momentary reference to FIG. 6, a smartcard module 600 has a lead frame layer 621 , 631 , the lead frame layer having a lead frame layer surface 627, 637 with a groove 623, 633 formed therein. The groove has a groove cross section extending inside the lead frame layer. An antenna wire 625, 635 is mounted within the groove. The antenna wire has an antenna wire cross section with a shape and thickness closely matching the groove cross section so that the uppermost portion of the antenna wire is substantially co-planar with the lead frame layer surface.
Referring to FIGS. 5A-5B, the present invention concerns an improved smartcard module 600 that eliminates all show-through. As shown in the top and cross-section views of FIG. 5A, the overmold completely encompasses the lead frame with no over hanging leads. This configuration eliminates all air gaps that might result in show- through. The back of the module (side opposite to overmold) is made up of two halves of the lead frame. Each half of the lead frame has a groove 623 and 633 whose depth equals the diameter of the antenna wire 625 and 635 to be mounted therein.
As shown in the top view of FIG. 5B, ends of the antenna wire 625 or 635 are embedded into the groove 623 or 633 and then attached to the lead frame using conventional bonding techniques such as thermal- compression bonding, soldering or conductive cement bonding. The bottom of the groove 623 or 633 is rounded so that the wire 625 or 635 is centered within the width of the groove. The groove 623, 633 runs along the entire width of the module for the wire 625, 635 to enter and exit at the same elevation, further minimizing any high points and thus eliminating the possibility for any show-through. Dimensions of the overmold are tightly controlled. This allows for a small clearance between the punched hole in the PVC sheet and the module outline. This further minimizes the air gap and eliminates any potential for show-through.
Referring to FIG. 6, there is shown an enlarged cross-section view of the smart card module 600. As shown, the smartcard module 600 includes a lead frame layer 621 , 631 , the lead frame layer having a lead frame surface 627, 637. Also shown is a silicon integrated circuit 601 coupled 603, 605 to the lead frame layer. The lead frame layer 621 , 631 is disposed on an epoxy layer 607. In accordance with the present invention, the antenna wire 625,
635 is attached to the lead frame layer 621 , 631 by a method comprising the steps of:
(a) forming a groove 623, 633 in the lead frame surface, the groove having a groove cross section extending inside the lead frame layer; and
(b) mounting or embedding the antenna wire 625, 635 within the groove, the antenna wire having an antenna wire cross section with a shape and thickness closely matching the groove cross section so that the uppermost portion of the antenna wire is substantially co-planar with the lead frame layer surface.
Moreover, a smartcard module 600 in accordance with the present invention includes a lead frame layer 621 , 631 , the lead frame layer having a lead frame layer surface 627, 637 with a groove 623, 633 formed therein, the groove having a groove cross section extending inside the lead frame layer, an antenna wire 625, 635 mounted or embedded within the groove, the antenna wire having an antenna wire cross section with a shape and thickness closely matching the groove cross section so that the uppermost portion of the antenna wire is substantially co-planar with the lead frame layer surface. A finished smartcard 700 is shown in FIG. 7, wherein the finished smartcard 700 includes the smartcard module 600.
The advantages of the invention are now discussed. The button module 600 has no leads projecting beyond the body or outline of the module and thus minimizes any air gaps that need to be filled during lamination. This eliminates any potential for show-through. The module the module also has rounded bottom grooves so that the antenna wire does not protrude above the top surface of the module, once again eliminating any potential for show-through. The outline of the module is defined by a molded surface and thus has tight dimensional accuracy and repeatability.
The industry has been using modules with leads for the past 4 years since the start of the contactless card market. Traditional thinking is that the lead must protrude beyond the body of the module so that the wire can be connected to it. It is believed non-obvious that the base of the module is also the lead and can be connected to just as easily. Furthermore, it is believed making a groove for the lead is unique.
An important result of the present invention is that the present configuration eliminates all show through without the use of expensive process like pre-press or dispensing filler materials. This results in savings of seven (7) cents per card, which amounts to a saving of $1.4 million per annum based on 20 million cards per annum.
While various embodiments of a smartcard module and method of attaching antenna wires thereto, in accordance with the present invention, have been described hereinabove, the scope of the invention is defined by the following claims.

Claims

I claim:CLAIMS
1. In a smartcard module having a lead frame layer, the lead frame layer having a lead frame surface, a method for attaching an antenna wire to the lead frame layer comprising the steps of:
(a) forming a groove in the lead frame surface, the groove having a groove cross section extending inside the lead frame layer; and (b) mounting the antenna wire within the groove, the antenna wire having an antenna wire cross section with a shape and thickness closely matching the groove cross section so that the uppermost portion of the antenna wire is substantially co-planar with the lead frame layer surface.
2. A smartcard module having a lead frame layer, the lead frame layer having a lead frame layer surface with a groove formed therein, the groove having a groove cross section extending inside the lead frame layer, an antenna wire within the groove, the antenna wire having an antenna wire cross section with a shape and thickness closely matching the groove cross section so that the uppermost portion of the antenna wire is substantially co-planar with the lead frame layer surface.
3. A smartcard including a smartcard module, the smartcard module having a lead frame layer, the lead frame layer having a lead frame layer surface with a groove formed therein, the groove having a groove cross section extending inside the lead frame layer, an antenna wire within the groove, the antenna wire having an antenna wire cross section with a shape and thickness closely matching the groove cross section so that the uppermost portion of the antenna wire is substantially co-planar with the lead frame layer surface.
PCT/US1999/023807 1998-11-12 1999-10-13 Smartcard module and method of attaching antenna wires thereto WO2000030210A1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US10807398P 1998-11-12 1998-11-12
US60/108,073 1998-11-12
US25674299A 1999-02-24 1999-02-24
US09/256,742 1999-02-24

Publications (1)

Publication Number Publication Date
WO2000030210A1 true WO2000030210A1 (en) 2000-05-25

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PCT/US1999/023807 WO2000030210A1 (en) 1998-11-12 1999-10-13 Smartcard module and method of attaching antenna wires thereto

Country Status (1)

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002061676A1 (en) * 2001-02-02 2002-08-08 Schlumberger Systèmes Portable object with chip and antenna
WO2002095673A1 (en) 2001-05-17 2002-11-28 Koninklijke Philips Electronics N.V. Lead-frame configuration for chips
WO2008141982A1 (en) * 2007-05-21 2008-11-27 Gemalto Sa Method for producing a device comprising a transponder antenna connected to contact pins and device obtained
WO2010052205A1 (en) * 2008-11-05 2010-05-14 Tomtom International B.V. Antenna arrangement apparatus
WO2011054697A1 (en) * 2009-11-09 2011-05-12 Feinics Amatech Teoranta Forming channels for an antenna wire of a transponder
US8613132B2 (en) 2009-11-09 2013-12-24 Feinics Amatech Teoranta Transferring an antenna to an RFID inlay substrate

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5412192A (en) * 1993-07-20 1995-05-02 American Express Company Radio frequency activated charge card
US5809633A (en) * 1994-09-05 1998-09-22 Siemens Aktiengesellschaft Method for producing a smart card module for contactless smart cards
US5892661A (en) * 1996-10-31 1999-04-06 Motorola, Inc. Smartcard and method of making
US5896111A (en) * 1994-09-05 1999-04-20 Siemens Aktiengesellschaft Antenna coil
US5898215A (en) * 1996-12-16 1999-04-27 Motorola, Inc. Microelectronic assembly with connection to a buried electrical element, and method for forming same
US5955021A (en) * 1997-05-19 1999-09-21 Cardxx, Llc Method of making smart cards

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5412192A (en) * 1993-07-20 1995-05-02 American Express Company Radio frequency activated charge card
US5809633A (en) * 1994-09-05 1998-09-22 Siemens Aktiengesellschaft Method for producing a smart card module for contactless smart cards
US5896111A (en) * 1994-09-05 1999-04-20 Siemens Aktiengesellschaft Antenna coil
US5892661A (en) * 1996-10-31 1999-04-06 Motorola, Inc. Smartcard and method of making
US5898215A (en) * 1996-12-16 1999-04-27 Motorola, Inc. Microelectronic assembly with connection to a buried electrical element, and method for forming same
US5955021A (en) * 1997-05-19 1999-09-21 Cardxx, Llc Method of making smart cards

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002061676A1 (en) * 2001-02-02 2002-08-08 Schlumberger Systèmes Portable object with chip and antenna
FR2820548A1 (en) * 2001-02-02 2002-08-09 Schlumberger Systems & Service PORTABLE CHIP AND ANTENNA OBJECT, MODULE FOR FORMING PORTABLE CHIP AND ANTENNA OBJECT AND METHODS OF MAKING SAME
WO2002095673A1 (en) 2001-05-17 2002-11-28 Koninklijke Philips Electronics N.V. Lead-frame configuration for chips
US7245005B2 (en) 2001-05-17 2007-07-17 Nxp B.V. Lead-frame configuration for chips
WO2008141982A1 (en) * 2007-05-21 2008-11-27 Gemalto Sa Method for producing a device comprising a transponder antenna connected to contact pins and device obtained
EP2001077A1 (en) * 2007-05-21 2008-12-10 Gemplus Method of manufacturing a device comprising a transponder antenna connected to connecting pads and device obtained
US8359729B2 (en) 2007-05-21 2013-01-29 Gemalto Sa Method for producing a device comprising a transponder antenna connected to contact pads in which soldering energy is applied directly to contact pads
WO2010052205A1 (en) * 2008-11-05 2010-05-14 Tomtom International B.V. Antenna arrangement apparatus
WO2011054697A1 (en) * 2009-11-09 2011-05-12 Feinics Amatech Teoranta Forming channels for an antenna wire of a transponder
US8613132B2 (en) 2009-11-09 2013-12-24 Feinics Amatech Teoranta Transferring an antenna to an RFID inlay substrate

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